FCB
| Definition | : | Flip Chip Bonding |
| Category | : | Academic & Science » Electronics |
| Country/Region | : | Worldwide  |
| Popularity | : |
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| Type | : |
Initialism
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What does FCB mean?
Flip Chip Bonding (FCB) is a semiconductor packaging technology used to connect Integrated Circuit (IC) to a substrate.
FCB involves the direct attachment of an IC chip to a substrate, such as a Printed Circuit Board (PCB), by flipping the chip upside down (hence the name flip chip) and bonding its electrical contacts to corresponding pads on the substrate.
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Frequently Asked Questions (FAQ)
What is the full form of FCB in Microelectronics?
The full form of FCB is Flip Chip Bonding
What are the full forms of FCB in Academic & Science?
Fired Clay Brick | Functional Cargo Block | Flip Chip Bonding
What are the full forms of FCB in Worldwide?
Foote, Cone & Belding | File Control Block | Fecal Coliform Bacteria | Fired Clay Brick | Forms Control Buffer | Frozen Carbonated Beverage | Functional Cargo Block | Flip Chip Bonding | FluoCortin Butyl
Translation
Find translations of Flip Chip Bonding